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Array packaging shrinks size, cost.
- Source :
-
Electronic Engineering Times (01921541) . 10/6/2003, Issue 1290, p79. 2p. - Publication Year :
- 2003
-
Abstract
- Reports on the trend among electronics component suppliers to integrate capacitors and resistors into arrays and networks and to turn to chip-scale and ball-grid-array packaging. Space savings, assembly cost reductions and faster throughput as advantages; Ability of the packaging approach to lower parasitic inductance, equivalent series resistance (ESR) and stray capacitance.
Details
- Language :
- English
- ISSN :
- 01921541
- Issue :
- 1290
- Database :
- Academic Search Index
- Journal :
- Electronic Engineering Times (01921541)
- Publication Type :
- Periodical
- Accession number :
- 11004162