Editorial 2014 IEEE TSM Best Paper Award.

High quality scholarship requires technical excellence and also connects the work to the primary references in the field. In this way, the reader advances their knowledge and gains perspective. The IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (TSM) supports these goals by recognizing the best paper chosen by the Associate Editors and reviewers. The winning paper was selected from 59 papers published by the TSM in 2014. The winner is “Feasibility Evaluation of Virtual Metrology for the Example of a Trench Etch Process” by Georg Roeder, Sirko Winzer, Martin Schellenberger, Stefan Jank, and Lothar Pfitzner published in the August 2014 issue of the IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING (10.1109/TSM.2014.2321192). Congratulations to the authors on being selected. [ABSTRACT FROM AUTHOR]