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Nonintrusive On-Line Transition-Time Binning and Timing Failure Threat Detection for Die-to-Die Interconnects.
- Source :
-
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems . Dec2015, Vol. 34 Issue 12, p2039-2048. 10p. - Publication Year :
- 2015
-
Abstract
- Die-to-die interconnects linking multiple functional dies in a modern 3-D or 2.5-D IC by micro-bumps could experience resistance increase after certain time of field operation due to parametric defects or aging. To cope with this reliability threat, we present an “on-line transition-time binning method” that aims to continuously detect excessive transition time occurring at a target die-to-die interconnect. Our method attaches a monitor to the termination end of each target interconnect. Any transition (rising or falling) is converted into a pulse-width first, which is then further compared to a dynamically tunable threshold for a binary pass/fail judgment. By multiple runs of transition-time monitoring while sweeping the threshold incrementally, the “transition-time bin” of each target interconnect can be derived and thereby a timing failure threat can be detected by a monitor center before it actually strikes. [ABSTRACT FROM PUBLISHER]
Details
- Language :
- English
- ISSN :
- 02780070
- Volume :
- 34
- Issue :
- 12
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems
- Publication Type :
- Academic Journal
- Accession number :
- 111152836
- Full Text :
- https://doi.org/10.1109/TCAD.2015.2440322