Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model application.

Cupping is a critical issue that affects the performance of a two-layer laminated densified wood product in service. Many parameters including material properties and product geometry can influence the cupping. It is more efficient to study the influence of these parameters on cupping using a model than by testing. A model sensitivity analysis is helpful in identifying key parameters so that product design can be optimized. This paper expanded the discussion on the finite element model developed and its application. It was found that (1) swelling/shrinkage coefficient and modulus of elasticity in the tangential direction and equilibrium moisture content were three key material parameters; (2) increasing the modulus of elasticity could offset part of cupping; (3) thickness ratio of two wood layers, as a key geometry parameter, was independent of three key material parameters; and (4) the optimal thickness ratio of two wood layers was 0.12. [ABSTRACT FROM AUTHOR]