PLASMA FIB PROVIDES VITAL DELAYERING AND SITE SPECIFIC FAILURE ANALYSIS CAPABILITIES FOR LARGER-SCALE STRUCTURES.

The article discusses the application of plasma focused ion beam (PFIB) technology which provides larger-scale integrated circuit structures a delayering or deprocessing and site-specific failure analysis capabilities. Topics discussed include the technology's ability to modify packaging circuits, the development of an open through-silicon vias (TSV) interconnect technology, and the interconnects quality in microelectronic packaging.