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Layer-by-layer composition and structure of silicon subjected to combined gallium and nitrogen ion implantation for the ion synthesis of gallium nitride.

Authors :
Korolev, D.
Mikhaylov, A.
Belov, A.
Vasiliev, V.
Guseinov, D.
Okulich, E.
Shemukhin, A.
Surodin, S.
Nikolitchev, D.
Nezhdanov, A.
Pirogov, A.
Pavlov, D.
Tetelbaum, D.
Source :
Semiconductors. Feb2016, Vol. 50 Issue 2, p271-275. 5p.
Publication Year :
2016

Abstract

The composition and structure of silicon surface layers subjected to combined gallium and nitrogen ion implantation with subsequent annealing have been studied by the X-ray photoelectron spectroscopy, Rutherford backscattering, electron spin resonance, Raman spectroscopy, and transmission electron microscopy techniques. A slight redistribution of the implanted atoms before annealing and their substantial migration towards the surface during annealing depending on the sequence of implantations are observed. It is found that about 2% of atoms of the implanted layer are replaced with gallium bonded to nitrogen; however, it is impossible to detect the gallium-nitride phase. At the same time, gallium-enriched inclusions containing ∼25 at % of gallium are detected as candidates for the further synthesis of gallium-nitride inclusions. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10637826
Volume :
50
Issue :
2
Database :
Academic Search Index
Journal :
Semiconductors
Publication Type :
Academic Journal
Accession number :
113082256
Full Text :
https://doi.org/10.1134/S1063782616020135