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ITEM: A temperature-dependent electromigration reliability...
- Source :
-
IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems . Aug97, Vol. 16 Issue 8, p882. 12p. 16 Diagrams, 1 Chart, 9 Graphs. - Publication Year :
- 1997
-
Abstract
- Presents an electromigration reliability diagnosis tool (iTEM) for complementary metal oxide semiconductor (CMOS) very-large scale integration (VLSI) circuits. Temperature effect on electromigration reliability; Block diagram of iTEM; Results of electrothermal timing simulation.
Details
- Language :
- English
- ISSN :
- 02780070
- Volume :
- 16
- Issue :
- 8
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems
- Publication Type :
- Academic Journal
- Accession number :
- 113852
- Full Text :
- https://doi.org/10.1109/43.644613