Single- and multilayer graphene wires as alternative interconnects.

In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to graphene with respect to contact resistance and mean free path. Experimentally we evaluate single and multi-layer graphene wires and we measure carrier mean free paths (MFPs) above ~ 110 nm. However, contact engineering will be the key issue for integration of graphene as interconnect. [ABSTRACT FROM AUTHOR]