Cite
Improving Reliability in Application-Specific 3D Network-on-Chip.
MLA
Hosseinzadeh, Farnoosh, et al. “Improving Reliability in Application-Specific 3D Network-on-Chip.” Proceedings of the World Congress on Engineering & Computer Science 2012 Volume I, Oct. 2012, pp. 180–85. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=asx&AN=115251158&authtype=sso&custid=ns315887.
APA
Hosseinzadeh, F., Bagherzadeh, N., Khademzadeh, A., Janidarmian, M., & Koupaei, F. K. (2012). Improving Reliability in Application-Specific 3D Network-on-Chip. Proceedings of the World Congress on Engineering & Computer Science 2012 Volume I, 180–185.
Chicago
Hosseinzadeh, Farnoosh, Nader Bagherzadeh, Ahmad Khademzadeh, Majid Janidarmian, and Fathollah Karimi Koupaei. 2012. “Improving Reliability in Application-Specific 3D Network-on-Chip.” Proceedings of the World Congress on Engineering & Computer Science 2012 Volume I, October, 180–85. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=asx&AN=115251158&authtype=sso&custid=ns315887.