Cite
High-Level Virtual Prototyping of Signal Integrity in Bus Communication.
MLA
Wang, Ruomin, et al. “High-Level Virtual Prototyping of Signal Integrity in Bus Communication.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 6, no. 6, June 2016, pp. 864–72. EBSCOhost, https://doi.org/10.1109/TCPMT.2016.2558288.
APA
Wang, R., Denoulet, J., Feruglio, S., Vallette, F., & Garda, P. (2016). High-Level Virtual Prototyping of Signal Integrity in Bus Communication. IEEE Transactions on Components, Packaging & Manufacturing Technology, 6(6), 864–872. https://doi.org/10.1109/TCPMT.2016.2558288
Chicago
Wang, Ruomin, Julien Denoulet, Sylvain Feruglio, Farouk Vallette, and Patrick Garda. 2016. “High-Level Virtual Prototyping of Signal Integrity in Bus Communication.” IEEE Transactions on Components, Packaging & Manufacturing Technology 6 (6): 864–72. doi:10.1109/TCPMT.2016.2558288.