Cite
High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications.
MLA
Zhao, Wen-Sheng, et al. “High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 6, no. 8, Aug. 2016, pp. 1226–32. EBSCOhost, https://doi.org/10.1109/TCPMT.2016.2580592.
APA
Zhao, W.-S., Zheng, J., Dong, L., Liang, F., Hu, Y., Wang, L., Wang, G., & Zhou, Q. (2016). High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications. IEEE Transactions on Components, Packaging & Manufacturing Technology, 6(8), 1226–1232. https://doi.org/10.1109/TCPMT.2016.2580592
Chicago
Zhao, Wen-Sheng, Jie Zheng, Linxi Dong, Feng Liang, Yue Hu, Luwen Wang, Gaofeng Wang, and Qifa Zhou. 2016. “High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications.” IEEE Transactions on Components, Packaging & Manufacturing Technology 6 (8): 1226–32. doi:10.1109/TCPMT.2016.2580592.