Cite
Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion.
MLA
Ishizaki, T., et al. “Power Cycle Reliability of Cu Nanoparticle Joints with Mismatched Coefficients of Thermal Expansion.” Microelectronics Reliability, vol. 64, Sept. 2016, pp. 287–93. EBSCOhost, https://doi.org/10.1016/j.microrel.2016.07.031.
APA
Ishizaki, T., Miura, D., Kuno, A., Nagao, R., Aoki, S., Ohshima, Y., Kino, T., Usui, M., & Yamada, Y. (2016). Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. Microelectronics Reliability, 64, 287–293. https://doi.org/10.1016/j.microrel.2016.07.031
Chicago
Ishizaki, T., D. Miura, A. Kuno, R. Nagao, S. Aoki, Y. Ohshima, T. Kino, M. Usui, and Y. Yamada. 2016. “Power Cycle Reliability of Cu Nanoparticle Joints with Mismatched Coefficients of Thermal Expansion.” Microelectronics Reliability 64 (September): 287–93. doi:10.1016/j.microrel.2016.07.031.