Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating.

MLA

Chen, Jin-Ju, et al. “Fabrication of Conductive Copper Patterns Using Reactive Inkjet Printing Followed by Two-Step Electroless Plating.” Applied Surface Science, vol. 396, Feb. 2017, pp. 202–07. EBSCOhost, https://doi.org/10.1016/j.apsusc.2016.09.152.

APA

Chen, J.-J., Lin, G.-Q., Wang, Y., Sowade, E., Baumann, R. R., & Feng, Z.-S. (2017). Fabrication of conductive copper patterns using reactive inkjet printing followed by two-step electroless plating. Applied Surface Science, 396, 202–207. https://doi.org/10.1016/j.apsusc.2016.09.152

Chicago

Chen, Jin-Ju, Guo-Qiang Lin, Yan Wang, Enrico Sowade, Reinhard R. Baumann, and Zhe-Sheng Feng. 2017. “Fabrication of Conductive Copper Patterns Using Reactive Inkjet Printing Followed by Two-Step Electroless Plating.” Applied Surface Science 396 (February): 202–7. doi:10.1016/j.apsusc.2016.09.152.