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Time-Domain Analysis of Noise Coupling Between Package and PCB Power/Ground Planes Based on WLP-FDTD.

Authors :
Tan, Xin
Li, Xiao-Chun
Mao, Junfa
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Feb2017, Vol. 7 Issue 2, p269-275. 7p.
Publication Year :
2017

Abstract

In this paper, a numerical approach based on weighted Laguerre polynomials finite-difference time-domain (WLP-FDTD) method is proposed to analyze noise coupling in power/ground planes between package and printed circuit board (PCB). Compared to the traditional finite-difference time-domain (FDTD) method, which is limited by Courant–Friedrich–Lecy stability condition, the proposed method has the unconditionally stable characteristic. Examples of a ball grid array package mounted on a PCB were simulated, and the numerical results show that the computation time of the proposed WLP-FDTD method can be 4.4% of that of the FDTD method at the same accuracy condition. Therefore, the proposed method has higher efficiency than the conventional FDTD method without sacrificing precision. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
7
Issue :
2
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
121251325
Full Text :
https://doi.org/10.1109/TCPMT.2016.2628050