Back to Search
Start Over
Reduction of Die-Bonding Interface Thermal Resistance for High-Power LEDs Through Embedding Packaging Structure.
- Source :
-
IEEE Transactions on Power Electronics . Jul2017, Vol. 32 Issue 7, p5520-5526. 7p. - Publication Year :
- 2017
-
Abstract
- Thermal management is a key issue for high-power light-emitting diodes (LEDs). In this study, a novel packaging structure was proposed to reduce the die-bonding interface thermal resistance and provided a new idea for LED heat-dissipation. The LED chip was embedded into a square groove at the lead-frame substrate. The gap between the edges of the LED chip and square groove was filled with boron nitride/silicone composite. So the heat generated from the chip could be dissipated from the side surfaces to the substrate. The experimental results show that the heat-dissipation ability of LEDs has been significantly improved by the new embedding packaging structure. The die-bonding interface thermal resistance can be reduced by more than 20%. The junction temperature rise can be reduced by 14%. Due to the fully embedding of LED chip in the square groove, the light intensity distribution is slightly shrunk and the light output power is slightly reduced by about 8%. [ABSTRACT FROM AUTHOR]
- Subjects :
- *THERMAL resistance
*HEAT transfer
*LIGHT emitting diodes
*SILICONES
*ELECTRIC power
Subjects
Details
- Language :
- English
- ISSN :
- 08858993
- Volume :
- 32
- Issue :
- 7
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Power Electronics
- Publication Type :
- Academic Journal
- Accession number :
- 121563562
- Full Text :
- https://doi.org/10.1109/TPEL.2016.2609891