Proton on Metal Fission Environments in an IC Package: An RHA Evaluation Method.

A study of proton-induced destructive SEE (DSEE) from Au-plated lid fission fragments has been expanded. Seventeen additional lid materials (Z =26–83) are studied. Lead (Pb) produced a higher sensitivity than seen in previous work with gold (Au), raising new concerns of SEE enhancement due to die-proximate Pb-based solder in flip-chip package designs. New analysis has allowed generalized RHA rules to be developed. [ABSTRACT FROM PUBLISHER]