Study on composite electroforming of Cu/SiCp composites

The composite electroforming technology was propounded to fabricate silicon carbide powder (SiCp) reinforced copper-based composites. The influences of the concentration of SiCp in plating solution, the temperature of plating solution and current density on the SiCp content in Cu/SiCp composites were studied. Results showed that it could promote codeposition of Cu and SiCp and increase SiCp content in composites effectively through optimizing the technology parameters. Results of the study on thermal and mechanical properties of Cu/SiCp composites indicated that with SiCp content (vol.%) increasing, bend strength and HV (Vickers hardness) increased, but coefficient of thermal expansion (CTE) and conductivity factor decreased. In addition, internal stress existed in Cu/SiCp composites, which had influences on HV and thermal expansion property of Cu/SiCp composites. [Copyright &y& Elsevier]