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Abrasive-free polishing of tungsten alloy using electrochemical etching.
- Source :
-
Electrochemistry Communications . Sep2017, Vol. 82, p80-84. 5p. - Publication Year :
- 2017
-
Abstract
- Tungsten alloy is a crucial engineering material for electrical and optical applications. However, damage-free and highly efficient polishing of tungsten has not been realized yet. We report the abrasive-free polishing of tungsten alloy using electrochemical polishing (ECP), which is an etching process. To achieve balance between polishing efficiency and surface quality, a two-step ECP process has been proposed. Current-driven ECP lasting for 3 min, as the first step, quickly removed the surface grinding marks and subsurface damage while the following potential-driven ECP lasted for 20 min, as the second step, improved the surface roughness and an ultra-smooth surface with an Ra roughness of 17.6 nm was finally obtained. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 13882481
- Volume :
- 82
- Database :
- Academic Search Index
- Journal :
- Electrochemistry Communications
- Publication Type :
- Academic Journal
- Accession number :
- 124821635
- Full Text :
- https://doi.org/10.1016/j.elecom.2017.07.030