XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects.

MLA

Ross, G., et al. “XRD and ToF-SIMS Study of Intermetallic Void Formation in Cu-Sn Micro-Connects.” Microelectronics Reliability, vol. 76, Sept. 2017, pp. 390–94. EBSCOhost, https://doi.org/10.1016/j.microrel.2017.07.044.

APA

Ross, G., Vuorinen, V., Krause, M., Reissaus, S., Petzold, M., & Paulasto-Kröckel, M. (2017). XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects. Microelectronics Reliability, 76, 390–394. https://doi.org/10.1016/j.microrel.2017.07.044

Chicago

Ross, G., V. Vuorinen, M. Krause, S. Reissaus, M. Petzold, and M. Paulasto-Kröckel. 2017. “XRD and ToF-SIMS Study of Intermetallic Void Formation in Cu-Sn Micro-Connects.” Microelectronics Reliability 76 (September): 390–94. doi:10.1016/j.microrel.2017.07.044.