Cite
Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films.
MLA
Cemin, Felipe, et al. “Benefits of Energetic Ion Bombardment for Tailoring Stress and Microstructural Evolution during Growth of Cu Thin Films.” Acta Materialia, vol. 141, Dec. 2017, pp. 120–30. EBSCOhost, https://doi.org/10.1016/j.actamat.2017.09.007.
APA
Cemin, F., Abadias, G., Minea, T., Furgeaud, C., Brisset, F., Solas, D., & Lundin, D. (2017). Benefits of energetic ion bombardment for tailoring stress and microstructural evolution during growth of Cu thin films. Acta Materialia, 141, 120–130. https://doi.org/10.1016/j.actamat.2017.09.007
Chicago
Cemin, Felipe, Gregory Abadias, Tiberiu Minea, Clarisse Furgeaud, François Brisset, Denis Solas, and Daniel Lundin. 2017. “Benefits of Energetic Ion Bombardment for Tailoring Stress and Microstructural Evolution during Growth of Cu Thin Films.” Acta Materialia 141 (December): 120–30. doi:10.1016/j.actamat.2017.09.007.