New Method of Screening Out Outlier; Expanded Part Average Testing During Package Level Test.

MLA

Sakamoto, Tadashi, et al. “New Method of Screening Out Outlier; Expanded Part Average Testing During Package Level Test.” IEEE Transactions on Semiconductor Manufacturing, vol. 30, no. 4, Nov. 2017, pp. 351–56. EBSCOhost, https://doi.org/10.1109/TSM.2017.2759298.

APA

Sakamoto, T., Yofu, K., & Kyuho, T. (2017). New Method of Screening Out Outlier; Expanded Part Average Testing During Package Level Test. IEEE Transactions on Semiconductor Manufacturing, 30(4), 351–356. https://doi.org/10.1109/TSM.2017.2759298

Chicago

Sakamoto, Tadashi, Kazunori Yofu, and Takashi Kyuho. 2017. “New Method of Screening Out Outlier; Expanded Part Average Testing During Package Level Test.” IEEE Transactions on Semiconductor Manufacturing 30 (4): 351–56. doi:10.1109/TSM.2017.2759298.