Modelling and characterization of a robust, low-power and wide-range thermal wind sensor.

In this paper, we present a robust, low-power and wide-range MEMS thermal wind sensor, which is based on a glass reflow process. A general analytical model is first proposed for obtaining the heater's temperature and the temperature distribution on the sensor surface. Based on this model, the effect of the sensor's geometry and package on the sensor's performance is investigated. These results demonstrate how the measurement range and the sensitivity of the sensor can be optimized with a change in structural geometries. Besides, it has shown that the package structure of the sensor is also important for obtaining the required performance. Then, calculated results are validated with 2-D finite element method (FEM) solver CMOSOL. It is found that although there is some deviation between theoretical and simulation results, the model can have good reference value for latter MEMS thermal wind sensor design. Finally, the sensor is characterized in a wind tunnel. At a constant heating power of 14.5 mW, measurement results show that the sensor can detect airflow speeds of up to 33 m/s, with an accuracy better than 0.5 m/s at low speeds and 5% Full-Scale at high speeds. Airflow direction can be determined in a 360° range with an accuracy better than 5°. In addition, the sensor also shows a good repeatability. [ABSTRACT FROM AUTHOR]