Cite
Modelling transient heat conduction of granular materials by numerical manifold method.
MLA
He, Jun, et al. “Modelling Transient Heat Conduction of Granular Materials by Numerical Manifold Method.” Engineering Analysis with Boundary Elements, vol. 86, Jan. 2018, pp. 45–55. EBSCOhost, https://doi.org/10.1016/j.enganabound.2017.10.011.
APA
He, J., Liu, Q., Wu, Z., & Xu, X. (2018). Modelling transient heat conduction of granular materials by numerical manifold method. Engineering Analysis with Boundary Elements, 86, 45–55. https://doi.org/10.1016/j.enganabound.2017.10.011
Chicago
He, Jun, Quansheng Liu, Zhijun Wu, and Xiangyu Xu. 2018. “Modelling Transient Heat Conduction of Granular Materials by Numerical Manifold Method.” Engineering Analysis with Boundary Elements 86 (January): 45–55. doi:10.1016/j.enganabound.2017.10.011.