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Real-Time Electrical Characteristics of Microprobe Testing Process in Microelectronics Packaging.

Authors :
Tian, Qing
Yuan, Qing
Wei, Xiaohui
Li, Junhui
Source :
IEEE Transactions on Semiconductor Manufacturing. Jan/Feb2018, Vol. 31 Issue 1, p166-172. 7p.
Publication Year :
2018

Abstract

In order to investigate the electrical characteristics of microprobe in integrated circuit testing, a wafer probe admittance testing system with motion control and admittance measurement instruments was organized by using pogo microprobe whose impedance characteristics are automatically measured and analyzed. The probe’s admittance characteristics under different loading frequency were explored based on voltammetry. The results show that the probe was resistive when loading frequency was less than 100 kHz, and being inductive when the frequency was larger than 100 kHz. Furthermore, the probe’s admittance was the least when the frequency was between 200 and 400 kHz. Meanwhile, the conductivity of tipped needle is smaller than claw pin when the frequency is between 1 and 500 kHz, whereas the susceptance and resistance of tipped needle is larger than claw pin, which mainly due to the change of contact between probe and the solder. [ABSTRACT FROM PUBLISHER]

Details

Language :
English
ISSN :
08946507
Volume :
31
Issue :
1
Database :
Academic Search Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
127632982
Full Text :
https://doi.org/10.1109/TSM.2017.2771802