Embedded passive components in advanced 3D chips and micro/nano electronic systems.

Electronic devices are shrinking day by day, while the speed and reliability is increasing. At the same time, IC designs and micro/nano electronic systems are becoming extremely complex with billions of components squeezed into a small area of silicon. Due to increase in functionality and decrease in size, number of components have increased on small area in IC and PWB. The use of passive components like capacitors, resistors and inductors is also increasing with time. The old surface mounted passive components occupy more area. The solution is to embed passive components inside the substrate, thereby decreasing the size. In the new technology, embedding passive components inside the substrate of the chip and the PWB results in an improvement in the reliability factor and at the same time improves the electrical performance. [ABSTRACT FROM AUTHOR]