Back to Search
Start Over
Versatile bondpad report process for non-planar compound semiconductor devices
- Source :
-
Microelectronic Engineering . May2004, Vol. 71 Issue 3/4, p358. 5p. - Publication Year :
- 2004
-
Abstract
- We present a versatile bondpad report process that can be used either for high relief compound semiconductor devices or interconnection schemes. It is based on the use of two different polymers (photoresists) and one electroplating step. [Copyright &y& Elsevier]
Details
- Language :
- English
- ISSN :
- 01679317
- Volume :
- 71
- Issue :
- 3/4
- Database :
- Academic Search Index
- Journal :
- Microelectronic Engineering
- Publication Type :
- Academic Journal
- Accession number :
- 12778114
- Full Text :
- https://doi.org/10.1016/j.mee.2004.03.082