High temperature dielectric polyetherimide film development.

A new high temperature ultra-thin polymer film based on Polyetherimide (PEI) chemistry has been developed and electrically characterized and compared with other dielectric capacitor films. More specifically, intrinsic and extrinsic dielectric breakdown strength is compared and reported for multiple resins thus demonstrating feasibility of the new polymer film. In addition, results from a large area electrode test are presented and the importance of this test method in the development of high temperature capacitors for DC applications is discussed. [ABSTRACT FROM AUTHOR]