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Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al.
- Source :
-
Ultrasonics Sonochemistry . Sep2018, Vol. 46, p79-88. 10p. - Publication Year :
- 2018
-
Abstract
- To prevent the formation of Al/Mg intermetallic compounds (IMCs) of Al 3 Mg 2 and Al 12 Mg 17 , dissimilar Al/Mg were ultrasonic-assisted soldered using Sn-based filler metals. A new IMC of Mg 2 Sn formed in the soldered joints during this process and it was prone to crack at large thickness. The thickness of Mg 2 Sn was reduced to 22 μm at 285 °C when using Sn-3Cu as the filler metal. Cracks were still observed inside the blocky Mg 2 Sn. The thickness of Mg 2 Sn was significantly reduced when using Sn-9Zn as the filler metal. A 17 μm Mg 2 Sn layer without crack was obtained at a temperature of 200 °C, ultrasonic power of Mode I, and ultrasonic time of 2 s. The shear strengths of the joints using Sn-9Zn was much higher than those using Sn-3Cu because of the thinner Mg 2 Sn layer in the former joints. Sn whiskers were prevented by using Sn-9Zn. A cavitation model during ultrasonic assisted soldering was proposed. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 13504177
- Volume :
- 46
- Database :
- Academic Search Index
- Journal :
- Ultrasonics Sonochemistry
- Publication Type :
- Academic Journal
- Accession number :
- 129465650
- Full Text :
- https://doi.org/10.1016/j.ultsonch.2018.04.010