Cite
Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.
MLA
Straessle, Rahel, et al. “Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 8, no. 5, May 2018, pp. 840–50. EBSCOhost, https://doi.org/10.1109/TCPMT.2017.2775154.
APA
Straessle, R., Zimmermann, S., del Carro, L., Zurcher, J., Schlottig, G., Achen, A., Hong, G., Poulikakos, D., & Brunschwiler, T. (2018). Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill. IEEE Transactions on Components, Packaging & Manufacturing Technology, 8(5), 840–850. https://doi.org/10.1109/TCPMT.2017.2775154
Chicago
Straessle, Rahel, Severin Zimmermann, Luca del Carro, Jonas Zurcher, Gerd Schlottig, Albert Achen, Guo Hong, Dimos Poulikakos, and Thomas Brunschwiler. 2018. “Thermally Conductive Composite Material With Percolating Microparticles Applied as Underfill.” IEEE Transactions on Components, Packaging & Manufacturing Technology 8 (5): 840–50. doi:10.1109/TCPMT.2017.2775154.