Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics.

Highlights • Direct observation of cavitation phenomena during ultrasonic-assisted soldering was first recorded. • Numerous tiny transient bubbles dominated in the cavitation field and limited steady bubbles were observed. • Cavitation intensity decreased with ultrasonic time. • Stronger cavitation was observed when small channel width and large ultrasonic power were used. Abstract The cavitation characteristics at filler metal/substrate interface during ultrasonic-assisted soldering were first recorded by high-speed photography in this work. Two kinds of bubbles, steady cavitation bubbles and transient cavitation bubbles were observed. Steady cavitation bubbles did not collapse within one acoustic period and could last longer than 50 acoustic periods. Transient cavitation bubbles formed and collapsed within one acoustic period. The cavitation process was divided into two stages based on the cavitation characteristics. The first violent cavitation stage was in fact the degassing process, which lasted approximately 2700 acoustic periods and was affected by the gas content trapped inside the filler metal and the stronger vibration at the initiation stage of ultrasonic-assisted soldering. The second steady cavitation stage had obvious low bubble density and accounted for the most of the soldering process. Higher cavitation densities were observed when small channel width and large ultrasonic power were used because of larger sound pressures inside the filler metal. [ABSTRACT FROM AUTHOR]