Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB.

Abstract We investigated the effect of Ag-coated multi-walled carbon nanotubes (Ag-MWCNT) on the microstructures and electromigration behaviors of a Sn58%Bi solder and organic solderability preservative (OSP) surface finished on the FR-4 printed circuit board (PCB) joint under a current stress of 3000 A/cm2 at 100 °C. Electromigration of Ag-MWCNT Sn58%Bi composite solder was investigated by daisy-chain test-kit. Reaction layers formed at the anode side and cathode side of the Sn58%Bi solder joints consisted of three microstructures; Bi-rich layer, Sn-rich layer, and intermetallic compounds (IMCs, Cu 6 Sn 5 and Cu 3 Sn). The Bi-rich layer was mainly formed at the anode side in the couple of the Sn58%Bi solder joint with various times of applying current stress. The Bi-rich layer of the Ag-MWCNT Sn58%Bi composite solder joint was approximately 2 times thinner than that of the Sn58%Bi solder joint because the Ag-MWCNT acts as a diffusion barrier. Also, the Cu 6 Sn 5 and Cu 3 Sn IMCs that formed at the interface between the Ag-MWCNT Sn58%Bi composite solder joints were thinner than those of the Sn58%Bi solder joints. The time to failure (TTF) was longest at the 0.05% Ag-MWCNT Sn58%Bi composite solder joint. Therefore, Ag MWCNT is expected to improve the reliability of electromigration in the Sn58%Bi composite solder joint. Highlights • The electromigration of the Ag-MWCNT Sn58%Bi composite solders were investigated. • Ag-coated MWCNTs were widely distributed in the Sn58%Bi solder joint. • MWCNT suppressed growths of Cu-Sn IMCs and Bi-rich layer under current stress. • TTF value of the 0.05 wt% Ag-MWCNT Sn58%Bi composite solder joint was the longest. [ABSTRACT FROM AUTHOR]