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Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology.
- Source :
-
Journal of Alloys & Compounds . Apr2019, Vol. 781, p873-882. 10p. - Publication Year :
- 2019
-
Abstract
- Abstract The current chip-level Au-Sn solder production process is very complex, to simplify the process while improving the quality of the solder, Au-20Sn solder ribbon was prepared by single-roll rapid solidification technology. The microstructure evolution, composition distribution, phase composition, melting characteristics, wettability and mechanical properties of the solder were studied. The rapidly solidified Au-20Sn solder alloy consisted of a small amount of primary ζ′-Au5Sn dendrites and eutectic structure (ζ′-Au5Sn+δ-AuSn). The microstructure was refined and the components were evenly distributed, while no new phase was formed during the annealing. With Sn element diffused into the δ-AuSn phase from the ζ′-Au5Sn phase, the ζ′-Au5Sn phase was decomposed and the δ-AuSn phase grew up and distributed in the matrix. After rolling, the δ-AuSn phase was elongated along the elongation direction of the ribbon, and the elements were further segregated. Ultimately, compared to the cast-rolling Au-20Sn solder, the melting range was narrower, and the wettability and the shear strength of the solder joint improved. Highlights • Au-20Sn solder was prepared by single-roll rapid solidification technology. • The primary phase of rapidly solidified Au-20Sn was obviously refined. • The refinement mechanism of rapidly solidified Au-20Sn solder is proposed. • The primary phase completely decomposed after suitable annealing process. • The properties of rapid solidification-rolling Au-20Sn solder were improved. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09258388
- Volume :
- 781
- Database :
- Academic Search Index
- Journal :
- Journal of Alloys & Compounds
- Publication Type :
- Academic Journal
- Accession number :
- 134530989
- Full Text :
- https://doi.org/10.1016/j.jallcom.2018.12.073