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Near-Field Radiation Estimation and Its Reduction Using a Novel EBG for PCB.

Authors :
Zuo, Panpan
Li, Yan
Xu, Yanbo
Zheng, Hongxing
Li, Er-Ping
Source :
IEEE Transactions on Components, Packaging & Manufacturing Technology. Feb2019, Vol. 9 Issue 2, p329-335. 7p.
Publication Year :
2019

Abstract

To investigate and quantify the radiation emission of an electronic package model, the partial element equivalent circuit method combined with the field equivalence principle is developed in this paper and used for the near-field radiation prediction. Furthermore, this paper presents a novel electromagnetic bandgap (EBG) design to suppress the electromagnetic radiation. The simulation results obtained by the proposed method have been validated against the measurement; moreover, the simulation and measurement results demonstrate the noise suppression ability of the new designed EBG structure, which can be used to reduce the electromagnetic radiation of the package. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
21563950
Volume :
9
Issue :
2
Database :
Academic Search Index
Journal :
IEEE Transactions on Components, Packaging & Manufacturing Technology
Publication Type :
Academic Journal
Accession number :
134537690
Full Text :
https://doi.org/10.1109/TCPMT.2018.2829023