Soldering porous ceramics through ultrasonic-induced capillary action and cavitation.

Abstract An ultrasonic-induced capillary action method was used to join porous ceramics for the first time. Results indicated that under ultrasonication, the solder infiltrated the porous ceramics and formed a soldered joint. The solder infiltration distance increased with prolonged ultrasonication time and reached 42 μm at an ultrasonication time of 120 s. Ceramic particles were eroded off and flowed into the joint seam because of the intense cavitation within narrow clearances. A fully penetrated layer formed near the joint seam at 120 s. This joint seam had high strength, so cracks propagated throughout the ceramic substrate during shear tests. Overall, our method was suitable for joining porous and microporous materials. Highlights • Porous ceramics were successfully joined by ultrasonic soldering. • Under ultrasonication, solder infiltrated the porous substrate to form a composite region. • Joint shear strength reached 33 MPa at 120 s, and crack propagated throughout the substrate. [ABSTRACT FROM AUTHOR]