Back to Search
Start Over
Advanced packaging lithography trends.
- Source :
-
Solid State Technology . Jan/Feb2019, Vol. 62 Issue 1, p15-16. 2p. - Publication Year :
- 2019
-
Abstract
- The article offers the author's insights on the market trends for advanced packaging (AP) lithography. Topics discussed include the expected increase in the worldwide adoption and innovation of AP lithography, possible growth of wafer-level packaging (WLP) content, and the major lithography challenges which include high aspect ratios of imaging submicron redistribution layers (RDL), overlay errors reduction, and handling of warped substrates.
Details
- Language :
- English
- ISSN :
- 0038111X
- Volume :
- 62
- Issue :
- 1
- Database :
- Academic Search Index
- Journal :
- Solid State Technology
- Publication Type :
- Academic Journal
- Accession number :
- 135591436