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Double-Gate TFET With Vertical Channel Sandwiched by Lightly Doped Si.

Authors :
Kim, Jang Hyun
Kim, Sangwan
Park, Byung-Gook
Source :
IEEE Transactions on Electron Devices. Apr2019, Vol. 66 Issue 4, p1656-1661. 6p.
Publication Year :
2019

Abstract

This paper examines a tunnel field-effect transistor (TFET) as a promising device for achieving steeper switching and better electrical performances in low-power operation. It features a double-gate TFET with vertical channel sandwiched by lightly doped Si (VS-TFET). The vertical tunnel junction is employed on the source side for the steeper subthreshold swing (SS) and for the higher ON-current (${I}_{ \mathrm{\scriptscriptstyle ON}}$) by restricting tunnel barrier width. The VS-TFET shows 17-mV/dec minimum SS and ${10}^{ {4}}~{ \mathrm{\scriptstyle ON}}/{ \mathrm{\scriptstyle OFF}}$ current ratio (${I}_{ \mathrm{\scriptscriptstyle ON}}/{I}_{ \mathrm{\scriptscriptstyle OFF}}$) for sub-0.7-V gate overdrive. In addition, the VS-TFET shows sub-60-mV/dec SS in a wide range of ${I}_{D}$ regardless of sweep directions. In conclusion, the work presented here demonstrates that the VS-TFET will be one of the most promising candidates for a next-generation low-power device. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00189383
Volume :
66
Issue :
4
Database :
Academic Search Index
Journal :
IEEE Transactions on Electron Devices
Publication Type :
Academic Journal
Accession number :
136509831
Full Text :
https://doi.org/10.1109/TED.2019.2899206