Cite
Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode.
MLA
Yi, Zhenxiang, et al. “Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode.” IEEE Transactions on Electron Devices, vol. 66, no. 5, May 2019, pp. 2375–81. EBSCOhost, https://doi.org/10.1109/TED.2019.2904976.
APA
Yi, Z., Ye, Y., Qin, M., & Huang, Q.-A. (2019). Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode. IEEE Transactions on Electron Devices, 66(5), 2375–2381. https://doi.org/10.1109/TED.2019.2904976
Chicago
Yi, Zhenxiang, Yizhou Ye, Ming Qin, and Qing-An Huang. 2019. “Modeling of Packaged MEMS Thermal Wind Sensor Operating on CP Mode.” IEEE Transactions on Electron Devices 66 (5): 2375–81. doi:10.1109/TED.2019.2904976.