Cite
Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package.
MLA
Wang, Zhiqiang, et al. “Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package.” IEEE Transactions on Industry Applications, vol. 55, no. 4, July 2019, pp. 4157–66. EBSCOhost, https://doi.org/10.1109/TIA.2019.2902839.
APA
Wang, Z., Yang, F., Campbell, S. L., & Chinthavali, M. (2019). Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package. IEEE Transactions on Industry Applications, 55(4), 4157–4166. https://doi.org/10.1109/TIA.2019.2902839
Chicago
Wang, Zhiqiang, Fei Yang, Steven L. Campbell, and Madhu Chinthavali. 2019. “Characterization of SiC Trench MOSFETs in a Low-Inductance Power Module Package.” IEEE Transactions on Industry Applications 55 (4): 4157–66. doi:10.1109/TIA.2019.2902839.