Flexible Electronics: Heat‐Free Fabrication of Metallic Interconnects for Flexible/Wearable Devices (Adv. Funct. Mater. 40/2019).

In article number 1903687, Martin Thuo and co-workers describe a unique heat-free approach for the fabrication of conductive metallic interconnects on diverse types of substrates. This method hinges on undercooled metal particles fabricated by encapsulating molten metal in thin shells to enable solidification. Heat-free solder, interconnects, liquid metal, multimaterial manufacturing, undercooled. [Extracted from the article]