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PREPARATION OF Cu-SiO2/PA12 COMPOSITE POWDERS BY ELECTROLESS PLATING FOR USE IN SLS PROCESSING.
- Source :
-
Surface Review & Letters . Nov2019, Vol. 26 Issue 9, pN.PAG-N.PAG. 8p. 3 Diagrams, 5 Graphs. - Publication Year :
- 2019
-
Abstract
- In this work, SiO2-encapsulated copper particles/PA12 (Cu-SiO2/PA12) composite powders were prepared by electroless composite plating, and the laser sintering behavior was investigated. Results showed that Cu, Cu2O, CuO, and SiO2 (Cu-SiO2) composite particles were plated on the surface of KH550-modified PA12 powders. The Cu-SiO2 particles existed independently on PA12 surface, and the size was around 200 nm. The melting temperature and crystallization temperature of Cu-SiO2/PA12 composite powders were 183∘C and 150∘C. The results indicate that the selective laser sintering (SLS) process involved the contact of Cu-SiO2/PA12 powders, the formation of sintering neck, the growth of sintering neck, and the formation of fused solid. The Cu-SiO2 composite particles uniformly dispersed in the part due to surface tension, and the contact interface was good due to their similar polarity. The Cu-SiO2/PA12 SLS parts had excellent dimensional precision. The tensile strength of the 15 W-sintered Cu-SiO2/PA12 specimen was 48 MPa. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 0218625X
- Volume :
- 26
- Issue :
- 9
- Database :
- Academic Search Index
- Journal :
- Surface Review & Letters
- Publication Type :
- Academic Journal
- Accession number :
- 139182178
- Full Text :
- https://doi.org/10.1142/S0218625X19500550