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A New Triple-Switch-Triple-Mode High Step-Up Converter With Wide Range of Duty Cycle for DC Microgrid Applications.

Authors :
Bhaskar, Mahajan Sagar
Alammari, Rashid
Meraj, Mohammad
Padmanaban, Sanjeevikumar
Iqbal, Atif
Source :
IEEE Transactions on Industry Applications. Nov/Dec2019, Vol. 55 Issue 6, p7425-7441. 17p.
Publication Year :
2019

Abstract

DC microgrid is gaining attraction and a recent trend in distribution power generation system due to penetration of renewables (especially photovoltaic or fuel cell). In this paper, a new triple-switch-triple-mode high step-up converter (TSTM-HS converter) is presented for dc microgrid applications. In the proposed converter, voltage lift technique is employed and range of duty cycle is extended by incorporating an additional switch in converter circuitry. By doing this, high voltage conversion ratio is achieved without using a transformer, coupled inductor, and multiple stages of switched capacitors. Moreover, the TSTM-HS converter operated in three modes with two types of the duty cycles to achieve low to high voltage conversion without using high duty cycle for each switch. The effects of difference in the inductance values on the regulation and operating behavior of the TSTM-HS converter are discussed. The continuous conduction mode and discontinuous conduction mode characteristics of the TSTM-HS converter are discussed in detail with steady-state analysis and boundary condition. The comparison is provided to highlight the benefits of the TSTM-HS converter. The selection of semiconductor devices and the design of reactive components are discussed for the TSTM-HS converter. The experimental results of the proposed converter are provided which validate the theoretical approach, performance, and feasibility of converter. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00939994
Volume :
55
Issue :
6
Database :
Academic Search Index
Journal :
IEEE Transactions on Industry Applications
Publication Type :
Academic Journal
Accession number :
139682103
Full Text :
https://doi.org/10.1109/TIA.2019.2920807