A novel surface polishing method and its fundamental performance in ultra-fine polishing of wafer.

MLA

Cao, Jianguo, et al. “A Novel Surface Polishing Method and Its Fundamental Performance in Ultra-Fine Polishing of Wafer.” International Journal of Advanced Manufacturing Technology, vol. 105, no. 7/8, Dec. 2019, pp. 2919–33. EBSCOhost, https://doi.org/10.1007/s00170-019-04473-9.

APA

Cao, J., Li, J., Nie, M., Zhu, P., Zhao, C., Zhang, J., Xuan, T., Xu, J., & Li, B. (2019). A novel surface polishing method and its fundamental performance in ultra-fine polishing of wafer. International Journal of Advanced Manufacturing Technology, 105(7/8), 2919–2933. https://doi.org/10.1007/s00170-019-04473-9

Chicago

Cao, Jianguo, Jianyong Li, Meng Nie, Pengzhe Zhu, Chaoyue Zhao, Jingjing Zhang, Tong Xuan, Jinhuan Xu, and Baozhen Li. 2019. “A Novel Surface Polishing Method and Its Fundamental Performance in Ultra-Fine Polishing of Wafer.” International Journal of Advanced Manufacturing Technology 105 (7/8): 2919–33. doi:10.1007/s00170-019-04473-9.