Back to Search
Start Over
Three Multiterminal Silicon Power Chips for an Optimized Monolithic Integration of Switching Cells: Validation on an H-Bridge Inverter.
- Source :
-
IEEE Transactions on Electron Devices . Dec2019, Vol. 66 Issue 12, p5238-5245. 8p. - Publication Year :
- 2019
-
Abstract
- This article deals with the monolithic integration in silicon of a multiphase static power converter (dc/ac or ac/dc) for medium power applications, from few kilowatts to few tens of kilowatts with power devices’ blocking capability in the range of 600–1200 V. This article presents an original three-chip integration approach that combines both monolithic integration in silicon and printed circuit board (PCB) packaging process and takes advantage of both silicon-level technology and PCB-level technology within a limited and well-mastered complexity. The converter is integrated within only three new multiterminal power chips, which are then judiciously packaged on a PCB so as to minimize the switching cell stray inductance and the impact of voltage variations (dv/dt) across the common-mode stray capacitance of the assembly. The static and the dynamic operating modes of the proposed multiterminal power chips were validated using 2-D-Sentaurus TCAD simulations. The realized chips were packaged on a PCB to realize both classical and three-chip-based H-bridge inverters. First characterization results validate the electrical operating modes of the H-bridge inverter realized according to the three-chip approach. [ABSTRACT FROM AUTHOR]
- Subjects :
- *PRINTED circuits
*SILICON
*BIPOLAR transistors
*ELECTRIC inductance
*PIN diodes
Subjects
Details
- Language :
- English
- ISSN :
- 00189383
- Volume :
- 66
- Issue :
- 12
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Electron Devices
- Publication Type :
- Academic Journal
- Accession number :
- 141052480
- Full Text :
- https://doi.org/10.1109/TED.2019.2946749