Cite
A Post-Bond TSV Test Method Based on RGC Parameters Measurement.
MLA
Yu, Yang, et al. “A Post-Bond TSV Test Method Based on RGC Parameters Measurement.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 39, no. 2, Feb. 2020, pp. 506–19. EBSCOhost, https://doi.org/10.1109/TCAD.2018.2887051.
APA
Yu, Y., Fang, X., & Peng, X. (2020). A Post-Bond TSV Test Method Based on RGC Parameters Measurement. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 39(2), 506–519. https://doi.org/10.1109/TCAD.2018.2887051
Chicago
Yu, Yang, Xu Fang, and Xiyuan Peng. 2020. “A Post-Bond TSV Test Method Based on RGC Parameters Measurement.” IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 39 (2): 506–19. doi:10.1109/TCAD.2018.2887051.