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Total ionizing dose effects on resistance stability of Pt/HfO2/Al2O3/TiN structure RRAM devices.

Authors :
Luo, Haipeng
Liang, Yifan
Tang, Minghua
Li, Gang
Xiong, Ying
Sun, Yunlong
Liu, Yulin
Ouyang, Sha
Xiao, Yongguang
Yan, Shaoan
Zhang, Wanli
Chen, Qilai
Li, Zheng
Source :
Microelectronics Reliability. Mar2020, Vol. 106, pN.PAG-N.PAG. 1p.
Publication Year :
2020

Abstract

Total-ionizing dose effects on the resistive switching properties of HfO 2 /Al 2 O 3 bipolar resistive-random-access-memory devices under 60Co γ irradiation were investigated in this study. Insignificant impact was found for 60Co γ irradiation with a dose of 200 krad (Si) but the impact became significant for higher irradiation intensity of 1 Mrad (Si). The experiment results indicated that it is possible for device high resistance off-state or low resistance on-state to change after a total ionizing dose step stress threshold being surpassed. Moreover, it was found that the 60Co γ irradiation of 1 Mrad (Si) caused degradation of device high-resistance state, low-resistance state, set/reset voltages, and endurance characteristics, due to the simultaneous induce of oxygen vacancies and displacement damage. Unlabelled Image [ABSTRACT FROM AUTHOR]

Subjects

Subjects :
*RESISTANCE to change
*IRRADIATION

Details

Language :
English
ISSN :
00262714
Volume :
106
Database :
Academic Search Index
Journal :
Microelectronics Reliability
Publication Type :
Academic Journal
Accession number :
141780537
Full Text :
https://doi.org/10.1016/j.microrel.2020.113592