Investigation of the failure mechanism of the TG-201 inhibitor: Promoting the synergistic effect of HP-13Cr stainless steel during the well completion.

• TG201 inhibitor contains Cu2+, and would acquire electrode prior to H+ to form Cu film in the process of acidizing. • The galvanic corrosion between HP-13Cr SS and Cu film could be neglected. • The failure mechanism resulted in the synergistic effect resulted from the Cu film among the process of well completion. • With the temperature and pressure increased, the corrosion rate and the synergistic effect would be enhanced obviously. TG-201 inhibitor could minimize corrosion of HP-13Cr SS in the process of live acid. Moreover, it accelerated the probability of serious corrosion of SS during the well completion. The failure mechanism of TG-201 inhibitor was investigated using surface analysis and electrochemical measurements. TG201 inhibitor contains amounts of Cu2+, which would acquire the electrons prior to H+ to form Cu film. The failure mechanism was due to the synergistic effect attributed to the Cu film. Cu film promoted the formation of the occluded cell and the changes of fluid state evoked by the increase in interfacial roughness during the well completion. [ABSTRACT FROM AUTHOR]