Cite
Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing.
MLA
Kim, Jungsoo, et al. “Effect of Ni(P) Thickness in Au/Pd/Ni(P) Surface Finish on the Electrical Reliability of Sn–3.0Ag–0.5Cu Solder Joints during Current-Stressing.” Journal of Alloys & Compounds, vol. 850, Jan. 2021, p. N.PAG. EBSCOhost, https://doi.org/10.1016/j.jallcom.2020.156729.
APA
Kim, J., Jung, S.-B., & Yoon, J.-W. (2021). Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing. Journal of Alloys & Compounds, 850, N.PAG. https://doi.org/10.1016/j.jallcom.2020.156729
Chicago
Kim, Jungsoo, Seung-Boo Jung, and Jeong-Won Yoon. 2021. “Effect of Ni(P) Thickness in Au/Pd/Ni(P) Surface Finish on the Electrical Reliability of Sn–3.0Ag–0.5Cu Solder Joints during Current-Stressing.” Journal of Alloys & Compounds 850 (January): N.PAG. doi:10.1016/j.jallcom.2020.156729.