Cite
The use of electroless copper seed in electrochemical deposited copper interconnect
MLA
Goh, Wang Ling, and Kee Tchuan Tan. “The Use of Electroless Copper Seed in Electrochemical Deposited Copper Interconnect.” Thin Solid Films, vol. 462/463, Sept. 2004, pp. 275–78. EBSCOhost, https://doi.org/10.1016/j.tsf.2004.05.100.
APA
Goh, W. L., & Tan, K. T. (2004). The use of electroless copper seed in electrochemical deposited copper interconnect. Thin Solid Films, 462/463, 275–278. https://doi.org/10.1016/j.tsf.2004.05.100
Chicago
Goh, Wang Ling, and Kee Tchuan Tan. 2004. “The Use of Electroless Copper Seed in Electrochemical Deposited Copper Interconnect.” Thin Solid Films 462/463 (September): 275–78. doi:10.1016/j.tsf.2004.05.100.