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Designing Power Module Health Monitoring Systems Based on Converter Load Profile.
- Source :
-
IEEE Transactions on Industry Applications . Nov/Dec2020, Vol. 56 Issue 6, p6711-6721. 11p. - Publication Year :
- 2020
-
Abstract
- This article presents a method for designing converter systems embedding power modules for a specified degradation monitoring performance in real-time applications. It builds upon prior work which identified specific variations in three-dimensional transient heat transfer with interface and interconnect state-of-health. This article contributes a joint, module-converter concurrent design method to quantify opportunities and limits in using chip-based temperature sensing to integrate electrothermal impedance spectroscopy in situ. Challenges intrinsic to modules, such as many, closely packed heat sources, are quantified. This article also examines spatial degrees-of-freedom for placing additional degradation sensing temperature detectors. Experimental measurements of transient thermal frequency response show trends that can be exploited to push temperature sensors against their signal-to-noise ratio limits. Overall, the design method relies on circuit topology and modulation details; it is directed toward early-stage converter development. To that end, an included harmonic loss modeling step immediately provides a designer with feedback about the feasibility of a degradation sensing concept. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00939994
- Volume :
- 56
- Issue :
- 6
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Industry Applications
- Publication Type :
- Academic Journal
- Accession number :
- 146892476
- Full Text :
- https://doi.org/10.1109/TIA.2020.3023070