Back to Search Start Over

Ceramic Interconnect, Ceramic Microsystems Technology.

Source :
American Ceramic Society Bulletin. Oct2004, Vol. 83 Issue 10, p13-13. 1/6p.
Publication Year :
2004

Abstract

Announces the issuance of a call for papers by the International Microelectronics & Packaging Society for the First International Conference on Ceramic Interconnect and Ceramic Microsystems Technology in Baltimore, Maryland. Venue and schedule of the conference; Event description.

Subjects

Subjects :
*CONFERENCES & conventions
*ASSOCIATIONS, institutions, etc.
*CERAMIC industries

Details

Language :
English
ISSN :
00027812
Volume :
83
Issue :
10
Database :
Academic Search Index
Journal :
American Ceramic Society Bulletin
Publication Type :
Periodical
Accession number :
14815462

Tools

Authors Abstract Subjects Details